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AS4C128M8D3A-12BIN

AS4C128M8D3A-12BIN

Product Overview

Category

AS4C128M8D3A-12BIN belongs to the category of computer memory modules.

Use

It is used as a Random Access Memory (RAM) module in various electronic devices such as computers, laptops, servers, and embedded systems.

Characteristics

  • Capacity: 128 Megabits (16 Megabytes)
  • Organization: 128M words x 8 bits x 8 banks
  • Speed: 12ns (nanoseconds)
  • Voltage: 3.3V
  • Package Type: BGA (Ball Grid Array)
  • Operating Temperature: -40°C to +85°C

Packaging/Quantity

AS4C128M8D3A-12BIN is typically packaged in trays or reels. The quantity per package depends on the manufacturer's specifications but is usually around 100 units per tray/reel.

Specifications

  • Memory Type: Synchronous DRAM (SDRAM)
  • Interface: Parallel
  • Clock Frequency: 83.33 MHz
  • Data Rate: 166.67 MT/s (Megatransfers per second)
  • Refresh Mode: Auto-refresh and Self-refresh
  • Burst Length: 8
  • CAS Latency: 3

Detailed Pin Configuration

The AS4C128M8D3A-12BIN module has a total of 60 pins. Here is the detailed pin configuration:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. VSS
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. BA0
  37. BA1
  38. RAS#
  39. CAS#
  40. WE#
  41. CS#
  42. VDD
  43. VSS
  44. CLK
  45. CKE
  46. DQM0
  47. DQM1
  48. DM0
  49. DM1
  50. VSS
  51. VDD
  52. NC
  53. NC
  54. NC
  55. VDD
  56. VSS
  57. VSS
  58. VSS
  59. VSS
  60. VSS

Functional Features

  • High-speed data transfer with a clock frequency of 83.33 MHz.
  • Auto-refresh and self-refresh modes for efficient memory management.
  • Burst mode operation with a burst length of 8, allowing for faster data access.
  • Low voltage operation at 3.3V, reducing power consumption.

Advantages and Disadvantages

Advantages

  • High capacity and organization, suitable for memory-intensive applications.
  • Fast data transfer rate, improving overall system performance.
  • Low power consumption, contributing to energy efficiency.
  • Compact BGA package, enabling space-saving designs.

Disadvantages

  • Limited compatibility with older systems that do not support SDRAM technology.
  • Relatively higher cost compared to lower capacity memory modules.
  • Sensitivity to electrostatic discharge (ESD) requires proper handling during installation.

Working Principles

AS4C128M8D3A-12BIN operates based on the principles of synchronous dynamic random access memory (SDRAM). It stores data in a matrix of capacitors, with each capacitor representing a single bit of information. The memory cells are organized into multiple banks, allowing for parallel access to data.

The module synchronizes its operations with an external clock signal and uses various control signals (RAS#, CAS#, WE#, CS#) to manage read and write operations. The data is transferred in bursts of 8 bits, optimizing data transfer efficiency.

Detailed Application Field Plans

AS4C128M8D3A-12BIN finds applications in a wide range of electronic devices and systems, including: 1. Desktop computers 2. Laptops and notebooks 3. Servers and data centers 4. Gaming consoles 5. Networking equipment 6. Industrial automation systems 7. Medical devices 8. Automotive electronics 9. Embedded systems

Detailed and Complete Alternative Models

Here are some alternative models that can be considered as alternatives to AS

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací AS4C128M8D3A-12BIN v technických řešeních

Sure! Here are 10 common questions and answers related to the application of AS4C128M8D3A-12BIN in technical solutions:

  1. Question: What is the capacity of the AS4C128M8D3A-12BIN memory module?
    Answer: The AS4C128M8D3A-12BIN has a capacity of 128 megabytes (MB).

  2. Question: What is the speed rating of the AS4C128M8D3A-12BIN?
    Answer: The AS4C128M8D3A-12BIN has a speed rating of 12 nanoseconds (ns).

  3. Question: What type of memory interface does the AS4C128M8D3A-12BIN use?
    Answer: The AS4C128M8D3A-12BIN uses a DDR3 SDRAM memory interface.

  4. Question: Can the AS4C128M8D3A-12BIN be used in laptops or desktop computers?
    Answer: Yes, the AS4C128M8D3A-12BIN can be used in both laptops and desktop computers that support DDR3 memory.

  5. Question: Is the AS4C128M8D3A-12BIN compatible with different operating systems?
    Answer: Yes, the AS4C128M8D3A-12BIN is compatible with various operating systems, including Windows, macOS, and Linux.

  6. Question: Can the AS4C128M8D3A-12BIN be used in gaming consoles or graphics cards?
    Answer: No, the AS4C128M8D3A-12BIN is not typically used in gaming consoles or graphics cards. It is primarily designed for general-purpose computing applications.

  7. Question: What voltage does the AS4C128M8D3A-12BIN operate at?
    Answer: The AS4C128M8D3A-12BIN operates at a voltage of 1.5 volts (V).

  8. Question: Can the AS4C128M8D3A-12BIN be overclocked for higher performance?
    Answer: Overclocking is not recommended for the AS4C128M8D3A-12BIN, as it may lead to instability and potential damage to the module.

  9. Question: Does the AS4C128M8D3A-12BIN support error correction (ECC)?
    Answer: No, the AS4C128M8D3A-12BIN does not support error correction. It is a non-ECC memory module.

  10. Question: Are there any specific temperature or humidity requirements for the AS4C128M8D3A-12BIN?
    Answer: The AS4C128M8D3A-12BIN should be operated within the specified temperature range of 0°C to 85°C and stored in a humidity-controlled environment to ensure optimal performance and longevity.