AS4C256M16D3L-12BINTR

Product Overview

Category

AS4C256M16D3L-12BINTR belongs to the category of computer memory modules.

Use

It is used as a Random Access Memory (RAM) module in various electronic devices such as computers, servers, and embedded systems.

Characteristics

• Capacity: 256 Megabits (32 Megabytes)
• Organization: 16M words x 16 bits x 8 banks
• Speed: 1200 MHz (DDR3-1200)
• Voltage: 1.5V
• Package Type: BGA (Ball Grid Array)
• Operating Temperature: -40°C to +85°C

Packaging/Quantity

AS4C256M16D3L-12BINTR is typically packaged in trays or reels. Each tray/reel contains a specific quantity of memory modules, usually around 100 units.

Specifications

• Memory Type: DDR3 SDRAM
• Interface: Parallel
• Data Rate: 1200 Mbps
• CAS Latency: 12
• Burst Length: 8
• Refresh: Auto-refresh and self-refresh modes supported
• Error Correction: Non-ECC (Error Correcting Code)
• Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array)

Detailed Pin Configuration

The AS4C256M16D3L-12BINTR module has a total of 96 pins arranged in a specific configuration. The pinout diagram is as follows:

```

Pin Name Description

1 VDD Power Supply 2 DQ0 Data Input/Output Bit 0 3 DQ1 Data Input/Output Bit 1 4 DQ2 Data Input/Output Bit 2 ... 96 VSS Ground ```

Functional Features

• High-speed data transfer with a maximum frequency of 1200 MHz.
• Low operating voltage of 1.5V, reducing power consumption.
• Supports auto-refresh and self-refresh modes for efficient memory management.
• Non-ECC design suitable for applications where error correction is not critical.

Advantages and Disadvantages

Advantages

• High-speed performance enhances overall system responsiveness.
• Low power consumption helps in energy-efficient designs.
• Compact BGA package allows for space-saving integration.
• Wide operating temperature range enables usage in various environments.

Disadvantages

• Limited capacity compared to higher-end memory modules.
• Non-ECC design may not be suitable for applications requiring error correction.

Working Principles

AS4C256M16D3L-12BINTR operates based on DDR3 SDRAM technology. It stores data in a matrix of capacitors, which can be accessed and manipulated at high speeds. The module communicates with the system through a parallel interface, allowing for rapid data transfer between the memory and the processor.

Detailed Application Field Plans

AS4C256M16D3L-12BINTR is widely used in the following application fields:

1. Personal Computers (PCs) - Enhances system performance and multitasking capabilities.
2. Servers - Provides reliable and fast memory access for data-intensive operations.
3. Embedded Systems - Enables efficient data storage and retrieval in compact devices.

Detailed and Complete Alternative Models

Some alternative models that offer similar specifications and functionality to AS4C256M16D3L-12BINTR are:

1. AS4C256M16D3A-12BINTR
2. MT41K256M16TW-107:P
3. K4B2G1646E-BCK0

These models can be considered as alternatives depending on specific requirements and availability.

Word count: 456