AS4C512M8D3LB-12BIN

Product Overview

Use

It is used as a Random Access Memory (RAM) module in various electronic devices, such as computers, laptops, servers, and embedded systems.

Characteristics

Capacity: 512 Megabits (64 Megabytes)
Organization: 8 Meg x 8 bits
Speed: 12ns
Package Type: BGA (Ball Grid Array)
Essence: High-performance memory module for data storage and retrieval

Packaging/Quantity

AS4C512M8D3LB-12BIN is typically packaged in anti-static trays or tubes. The quantity per package may vary depending on the manufacturer's specifications.

Specifications

Part Number: AS4C512M8D3LB-12BIN
Memory Type: Synchronous Dynamic RAM (SDRAM)
Interface: Double Data Rate 3 (DDR3)
Operating Voltage: 1.5V
Clock Frequency: 800 MHz
Operating Temperature Range: -40°C to +85°C
Pin Count: 96 pins
Memory Organization: 64M x 8 bits
Refresh Mode: Auto-refresh and Self-refresh
Burst Length: 8

Detailed Pin Configuration

The AS4C512M8D3LB-12BIN module has a total of 96 pins. The pin configuration is as follows:

VDD
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
VSS
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
VSS
A0
A1
A2
A3
A4
A5
A6
A7
VSS
A8
A9
A10
A11
A12
A13
A14
A15
VSS
BA0
BA1
RAS#
CAS#
WE#
CS#
VSS
DM0
DM1
VCC
VSS
CLK
CKE
ODT#
RESET#
VSS
VREF
VSS
DQS0
DQS#0
VSS
DQS1
DQS#1
VSS
DQS2
DQS#2
VSS
DQS3
DQS#3
VSS
DQS4
DQS#4
VSS
DQS5
DQS#5
VSS
DQS6
DQS#6
VSS
DQS7
DQS#7
VSS
VDDSPD
SPD0
SPD1
SPD2
SPD3
SPD4
SPD5
SPD6
SPD7
VSS
VDDSPD
SDA
SCL
VSS
VDD
VSS
NC

Functional Features

High-speed data transfer with DDR3 interface
Low power consumption
Auto-refresh and self-refresh modes for efficient memory management
Support for burst mode operations
On-die termination (ODT) for improved signal integrity
Serial Presence Detect (SPD) for automatic configuration

Advantages and Disadvantages

Advantages

High-performance memory module suitable for demanding applications
Efficient data transfer and storage capabilities
Low power consumption for energy-efficient systems
Compact BGA package for space-constrained designs

Disadvantages

Limited capacity compared to higher-end memory modules
Compatibility may vary depending on the device and system requirements

Working Principles

AS4C512M8D3LB-12BIN operates based on the principles of synchronous

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací AS4C512M8D3LB-12BIN v technických řešeních

Question: What is the capacity of the AS4C512M8D3LB-12BIN memory module?
Answer: The AS4C512M8D3LB-12BIN is a 512 Megabit (64 Megabyte) memory module.
Question: What is the operating voltage range for this memory module?
Answer: The AS4C512M8D3LB-12BIN operates at a voltage range of 1.7V to 1.95V.
Question: What is the clock frequency supported by this memory module?
Answer: The AS4C512M8D3LB-12BIN supports a clock frequency of up to 133 MHz.
Question: Is this memory module compatible with DDR3 memory interfaces?
Answer: Yes, the AS4C512M8D3LB-12BIN is designed to be compatible with DDR3 memory interfaces.
Question: Can this memory module be used in both desktop and laptop computers?
Answer: Yes, the AS4C512M8D3LB-12BIN can be used in both desktop and laptop computers as long as they support DDR3 memory.
Question: What is the CAS latency of this memory module?
Answer: The AS4C512M8D3LB-12BIN has a CAS latency of 12 cycles.
Question: Does this memory module support ECC (Error Correction Code)?
Answer: No, the AS4C512M8D3LB-12BIN does not support ECC.
Question: Can this memory module be used in dual-channel configurations?
Answer: Yes, the AS4C512M8D3LB-12BIN can be used in dual-channel configurations for increased memory performance.
Question: What is the physical form factor of this memory module?
Answer: The AS4C512M8D3LB-12BIN follows the Small Outline DIMM (SODIMM) form factor.
Question: Is this memory module compatible with other DDR3 memory modules from different manufacturers?
Answer: Yes, as long as the other DDR3 memory modules have similar specifications and are compatible with the system's memory interface, they can be used together with the AS4C512M8D3LB-12BIN.