Alliance Memory, Inc.
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AS4C64M16D2-25BIN
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AS4C64M16D2-25BIN

Product Overview

Category

AS4C64M16D2-25BIN belongs to the category of semiconductor memory products.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and embedded systems.

Characteristics

  • High-speed performance
  • Large storage capacity
  • Low power consumption
  • Reliable data retention
  • Compact package size

Package

AS4C64M16D2-25BIN is available in a small outline dual in-line memory module (SO-DIMM) package.

Essence

The essence of AS4C64M16D2-25BIN lies in its ability to store and retrieve digital information quickly and efficiently.

Packaging/Quantity

AS4C64M16D2-25BIN is typically packaged in trays or reels, with each containing a specific quantity of memory modules.

Specifications

  • Part Number: AS4C64M16D2-25BIN
  • Memory Type: Synchronous DRAM (SDRAM)
  • Organization: 64 Megabit x 16
  • Operating Voltage: 2.5V
  • Speed Grade: 25
  • Interface: Double Data Rate (DDR2)
  • Pin Count: 200
  • Clock Frequency: Up to 400 MHz
  • Refresh Mode: Auto-refresh and self-refresh
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C64M16D2-25BIN has a total of 200 pins. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. DQ8
  11. DQ9
  12. DQ10
  13. DQ11
  14. DQ12
  15. DQ13
  16. DQ14
  17. DQ15
  18. VSS
  19. NC
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. A16
  37. A17
  38. A18
  39. A19
  40. A20
  41. A21
  42. A22
  43. A23
  44. A24
  45. A25
  46. A26
  47. A27
  48. A28
  49. A29
  50. A30
  51. A31
  52. BA0
  53. BA1
  54. RAS#
  55. CAS#
  56. WE#
  57. CS#
  58. CKE
  59. CK
  60. DQS0#
  61. DQS0
  62. DM0
  63. VSS
  64. VDD (Continued...)

Functional Features

  • High-speed data transfer rate
  • Burst mode operation for efficient data access
  • On-die termination (ODT) for improved signal integrity
  • Programmable burst length and latency settings
  • Auto-precharge and auto-refresh capabilities
  • Low-power standby mode

Advantages

  • Fast and reliable data storage and retrieval
  • Suitable for various electronic devices and applications
  • Compact form factor for space-constrained designs
  • Low power consumption for energy-efficient operation
  • Wide operating temperature range for versatile usage scenarios

Disadvantages

  • Limited storage capacity compared to higher-end memory options
  • Relatively higher cost per unit compared to lower-capacity alternatives
  • Requires compatible interface and controller for proper operation

Working Principles

AS4C64M16D2-25BIN operates based on the principles of synchronous dynamic random-access memory (SDRAM). It stores digital data in a matrix of capacitors, with each capacitor representing a single bit of information. The memory cells are organized into rows and columns, allowing for efficient access and retrieval of data.

Detailed Application Field Plans

AS4C64M16D2-25BIN finds applications in various fields, including but not limited to: - Personal computers - Laptops and notebooks - Servers and data centers - Networking equipment - Industrial automation systems - Automotive electronics - Medical devices - Consumer electronics

Detailed and Complete Alternative Models

Some alternative models that can be considered as alternatives to AS4C64M16D2-25BIN include: - AS4C64M16D2A-25BIN - AS4

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací AS4C64M16D2-25BIN v technických řešeních

Sure! Here are 10 common questions and answers related to the application of AS4C64M16D2-25BIN in technical solutions:

  1. Question: What is the AS4C64M16D2-25BIN?
    Answer: The AS4C64M16D2-25BIN is a specific type of memory chip commonly used in technical solutions.

  2. Question: What is the capacity of the AS4C64M16D2-25BIN?
    Answer: The AS4C64M16D2-25BIN has a capacity of 64 megabits (8 megabytes).

  3. Question: What is the speed rating of the AS4C64M16D2-25BIN?
    Answer: The AS4C64M16D2-25BIN has a speed rating of 25 nanoseconds.

  4. Question: What is the pin configuration of the AS4C64M16D2-25BIN?
    Answer: The AS4C64M16D2-25BIN has a 90-ball FBGA (Fine-Pitch Ball Grid Array) package with a specific pin configuration.

  5. Question: What voltage does the AS4C64M16D2-25BIN operate at?
    Answer: The AS4C64M16D2-25BIN operates at a voltage of 2.5 volts.

  6. Question: What is the operating temperature range of the AS4C64M16D2-25BIN?
    Answer: The AS4C64M16D2-25BIN has an operating temperature range of -40°C to +85°C.

  7. Question: Can the AS4C64M16D2-25BIN be used in industrial applications?
    Answer: Yes, the AS4C64M16D2-25BIN is suitable for use in industrial applications due to its wide operating temperature range.

  8. Question: Is the AS4C64M16D2-25BIN compatible with common microcontrollers?
    Answer: Yes, the AS4C64M16D2-25BIN is compatible with many common microcontrollers and can be easily integrated into various technical solutions.

  9. Question: Can the AS4C64M16D2-25BIN be used in high-speed data transfer applications?
    Answer: Yes, the AS4C64M16D2-25BIN's speed rating of 25 nanoseconds makes it suitable for high-speed data transfer applications.

  10. Question: Are there any specific design considerations when using the AS4C64M16D2-25BIN?
    Answer: It is important to consider factors such as power supply stability, signal integrity, and proper PCB layout when designing with the AS4C64M16D2-25BIN to ensure optimal performance.

Please note that these questions and answers are general and may vary depending on the specific requirements and application of the AS4C64M16D2-25BIN in a technical solution.