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MT48LC64M8A2TG-75:C

MT48LC64M8A2TG-75:C

Product Overview

Category

The MT48LC64M8A2TG-75:C belongs to the category of dynamic random access memory (DRAM) chips.

Use

This product is primarily used in electronic devices such as computers, servers, and networking equipment for storing and accessing data during operation.

Characteristics

  • High-speed performance: The MT48LC64M8A2TG-75:C offers fast data transfer rates, enabling efficient processing of large amounts of information.
  • Large storage capacity: With a capacity of 64 megabits (8 megabytes), this DRAM chip provides ample space for data storage.
  • Low power consumption: The chip is designed to operate with minimal power requirements, making it energy-efficient.
  • Wide temperature range: The MT48LC64M8A2TG-75:C can function reliably across a broad temperature spectrum, ensuring its suitability for various environments.

Package and Quantity

This product is available in a surface-mount package, specifically the Thin Small Outline Package (TSOP). It is typically sold in reels or trays containing multiple units.

Specifications

  • Memory Type: Dynamic Random Access Memory (DRAM)
  • Organization: 64 Megabits x 8
  • Operating Voltage: 3.3V
  • Speed Grade: -75
  • Refresh Mode: Auto-refresh and self-refresh
  • Package Type: TSOP
  • Pin Count: 48 pins

Detailed Pin Configuration

The MT48LC64M8A2TG-75:C features a total of 48 pins, each serving a specific purpose. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. A0
  12. A1
  13. A2
  14. A3
  15. A4
  16. A5
  17. A6
  18. A7
  19. A8
  20. A9
  21. A10
  22. A11
  23. A12
  24. A13
  25. A14
  26. A15
  27. A16
  28. A17
  29. A18
  30. A19
  31. A20
  32. A21
  33. A22
  34. WE#
  35. CAS#
  36. RAS#
  37. CKE
  38. CS#
  39. BA0
  40. BA1
  41. DQM0
  42. DQM1
  43. DQS0
  44. DQS1
  45. DM0
  46. DM1
  47. VREF
  48. VSS

Functional Features

The MT48LC64M8A2TG-75:C offers the following functional features:

  • High-speed data transfer: The chip allows for rapid reading and writing of data, facilitating efficient processing.
  • Auto-refresh and self-refresh modes: These modes ensure that the stored data is maintained and refreshed automatically, reducing the need for manual intervention.
  • Low power consumption: The DRAM chip is designed to operate with minimal power requirements, conserving energy and prolonging battery life in portable devices.

Advantages and Disadvantages

Advantages

  • Fast data transfer rates enable quick access to information.
  • Large storage capacity accommodates substantial amounts of data.
  • Energy-efficient design minimizes power consumption.
  • Wide temperature range ensures reliability in various environments.

Disadvantages

  • As a volatile memory, data is lost when power is disconnected.
  • Relatively higher latency compared to other types of memory.
  • Sensitive to electrical noise and requires proper shielding.

Working Principles

The MT48LC64M8A2TG-75:C operates based on the principles of dynamic random access memory. It stores data in capacitors within each memory cell, which must be periodically refreshed to maintain the stored information. When a read or write operation is initiated, the chip accesses the specific memory location using the provided address and transfers the data accordingly.

Detailed Application Field Plans

The MT48LC64M8A2TG-75:C finds extensive application in various electronic devices and systems, including:

  1. Personal computers and laptops
  2. Servers and data centers
  3. Networking equipment (routers, switches)
  4. Mobile devices (smartphones, tablets)
  5. Automotive electronics
  6. Industrial control systems
  7. Medical equipment

Alternative Models

For those seeking alternative options, the following DRAM chips can be considered:

  1. MT48LC32M8A2TG-75:C - 32 Megabit x 8 organization, similar characteristics and package.
  2. MT48LC128M8

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT48LC64M8A2TG-75:C v technických řešeních

  1. What is the MT48LC64M8A2TG-75:C?

    • The MT48LC64M8A2TG-75:C is a specific type of synchronous dynamic random-access memory (SDRAM) chip commonly used in technical solutions.
  2. What is the capacity of the MT48LC64M8A2TG-75:C?

    • The MT48LC64M8A2TG-75:C has a capacity of 64 megabits, which is equivalent to 8 megabytes.
  3. What is the speed rating of the MT48LC64M8A2TG-75:C?

    • The "75" in the part number indicates that the MT48LC64M8A2TG-75:C operates at a maximum clock frequency of 75 MHz.
  4. What is the voltage requirement for the MT48LC64M8A2TG-75:C?

    • The MT48LC64M8A2TG-75:C operates at a standard voltage of 3.3 volts (V).
  5. What is the package type of the MT48LC64M8A2TG-75:C?

    • The MT48LC64M8A2TG-75:C comes in a TSOP II (Thin Small Outline Package) form factor.
  6. What are the typical applications of the MT48LC64M8A2TG-75:C?

    • The MT48LC64M8A2TG-75:C is commonly used in various technical solutions such as embedded systems, networking equipment, telecommunications devices, and industrial control systems.
  7. Does the MT48LC64M8A2TG-75:C support burst mode operation?

    • Yes, the MT48LC64M8A2TG-75:C supports burst mode operation, allowing for faster data transfer rates.
  8. What is the operating temperature range of the MT48LC64M8A2TG-75:C?

    • The MT48LC64M8A2TG-75:C is designed to operate within a temperature range of -40°C to +85°C.
  9. Does the MT48LC64M8A2TG-75:C have any built-in error correction capabilities?

    • No, the MT48LC64M8A2TG-75:C does not have built-in error correction capabilities. Additional error correction mechanisms may need to be implemented if required.
  10. Is the MT48LC64M8A2TG-75:C a commonly available component?

    • Yes, the MT48LC64M8A2TG-75:C is a widely used SDRAM chip and can be readily sourced from various electronic component suppliers.