CY7C1250V18-333BZC

Product Overview

Category

The CY7C1250V18-333BZC belongs to the category of high-performance synchronous SRAM (Static Random Access Memory) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices such as computers, servers, networking equipment, and telecommunications systems.

Characteristics

• High Performance: The CY7C1250V18-333BZC offers fast access times and high-speed data transfer rates, making it suitable for demanding applications.
• Large Capacity: With a capacity of 1,250 megabits (Mb), this SRAM chip provides ample storage space for data-intensive tasks.
• Low Power Consumption: Despite its high performance, the CY7C1250V18-333BZC is designed to operate efficiently with low power consumption.
• Reliable Operation: This chip incorporates advanced error correction techniques and built-in self-test capabilities, ensuring data integrity and system reliability.

Package

The CY7C1250V18-333BZC is available in a compact and industry-standard BGA (Ball Grid Array) package. This package offers excellent thermal dissipation properties and facilitates easy integration into circuit boards.

Essence

The essence of the CY7C1250V18-333BZC lies in its ability to provide high-speed and reliable data storage, enabling efficient processing and execution of complex tasks in electronic devices.

Packaging/Quantity

This product is typically sold in reels or trays, depending on the manufacturer's packaging standards. The exact quantity per package may vary, but it is commonly available in quantities suitable for both small-scale and large-scale production.

Specifications

• Memory Type: Synchronous SRAM
• Capacity: 1,250 Mb
• Access Time: 333 nanoseconds
• Operating Voltage: 3.3 volts
• Interface: Parallel
• Package Type: BGA
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The CY7C1250V18-333BZC features a specific pin configuration that facilitates its integration into electronic circuits. The detailed pin configuration is as follows:

1. VDDQ: Power Supply (3.3V)
2. DQ[0:17]: Data Input/Output Lines
3. VSSQ: Ground
4. DQ[18:35]: Data Input/Output Lines
5. VDDQ: Power Supply (3.3V)
6. DQ[36:53]: Data Input/Output Lines
7. VSSQ: Ground
8. DQ[54:71]: Data Input/Output Lines
9. VDDQ: Power Supply (3.3V)
10. DQ[72:89]: Data Input/Output Lines
11. VSSQ: Ground
12. DQ[90:107]: Data Input/Output Lines
13. VDDQ: Power Supply (3.3V)
14. DQ[108:125]: Data Input/Output Lines
15. VSSQ: Ground
16. DQ[126:143]: Data Input/Output Lines
17. VDDQ: Power Supply (3.3V)
18. DQ[144:161]: Data Input/Output Lines
19. VSSQ: Ground
20. DQ[162:179]: Data Input/Output Lines
21. VDDQ: Power Supply (3.3V)
22. DQ[180:197]: Data Input/Output Lines
23. VSSQ: Ground
24. DQ[198:215]: Data Input/Output Lines
25. VDDQ: Power Supply (3.3V)
26. DQ[216:233]: Data Input/Output Lines
27. VSSQ: Ground
28. DQ[234:251]: Data Input/Output Lines
29. VDDQ: Power Supply (3.3V)
30. DQ[252:269]: Data Input/Output Lines
31. VSSQ: Ground
32. DQ[270:287]: Data Input/Output Lines
33. VDDQ: Power Supply (3.3V)
34. DQ[288:305]: Data Input/Output Lines
35. VSSQ: Ground
36. DQ[306:323]: Data Input/Output Lines
37. VDDQ: Power Supply (3.3V)
38. DQ[324:341]: Data Input/Output Lines
39. VSSQ: Ground
40. DQ[342:359]: Data Input/Output Lines
41. VDDQ: Power Supply (3.3V)