CY7C1314CV18-250BZC

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics: High-speed, low-power, synchronous SRAM
• Package: BGA (Ball Grid Array)
• Essence: 18-Mbit (2M x 9) SRAM
• Packaging/Quantity: Tray packaging, quantity varies

Specifications

• Capacity: 18 Mbit
• Organization: 2M x 9
• Voltage: 1.8V
• Speed: 250 MHz
• Access Time: 10 ns
• Operating Temperature Range: -40°C to +85°C
• Interface: Parallel

Detailed Pin Configuration

The CY7C1314CV18-250BZC has a total of 119 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDDQ | Power supply for I/O buffers | | 2 | DQ0 | Data input/output bit 0 | | 3 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 118 | VSSQ | Ground for I/O buffers | | 119 | VDD | Power supply for core logic |

Functional Features

• High-speed operation: The CY7C1314CV18-250BZC operates at a speed of 250 MHz, allowing for fast data access.
• Low power consumption: It is designed to consume minimal power, making it suitable for battery-powered devices.
• Synchronous operation: The SRAM synchronizes with the system clock, ensuring reliable and accurate data transfer.
• Easy integration: The IC can be easily integrated into various electronic systems due to its compact BGA package.

Advantages and Disadvantages

Advantages: - High-speed operation enables quick data access. - Low power consumption prolongs battery life. - Synchronous operation ensures reliable data transfer. - Compact BGA package allows for easy integration.

Disadvantages: - Limited capacity compared to higher-end memory modules. - Higher cost per bit compared to larger memory modules.

Working Principles

The CY7C1314CV18-250BZC is a synchronous SRAM that stores and retrieves data using an array of memory cells. It operates by synchronizing with the system clock, allowing for precise timing and reliable data transfer. The IC utilizes advanced circuitry to achieve high-speed operation while consuming minimal power.

Detailed Application Field Plans

The CY7C1314CV18-250BZC is commonly used in various applications that require high-speed and low-power memory modules. Some of the typical application fields include: - Networking equipment - Telecommunications systems - Industrial automation - Medical devices - Consumer electronics

Detailed and Complete Alternative Models

• CY7C1314CV18-250BZI: Similar specifications but available in an industrial temperature range.
• CY7C1314CV18-250BZXI: Similar specifications but available in an extended industrial temperature range.
• CY7C1314CV18-250BZXC: Similar specifications but available in a ceramic package.

These alternative models provide similar functionality and performance but may differ in temperature range, package type, or other specific requirements.

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