GD25Q16CSJGR

Product Overview

• Category: Flash Memory
• Use: Data storage and retrieval in electronic devices
• Characteristics: High-speed, non-volatile memory with low power consumption
• Package: SOP8 (Small Outline Package 8)
• Essence: Serial Peripheral Interface (SPI) Flash Memory
• Packaging/Quantity: Available in tape and reel packaging, quantity varies based on customer requirements

Specifications

• Memory Capacity: 16 Megabits (2 Megabytes)
• Interface: SPI (Serial Peripheral Interface)
• Operating Voltage: 2.7V - 3.6V
• Operating Temperature: -40°C to +85°C
• Write/Erase Endurance: 100,000 cycles
• Data Retention: 20 years

Pin Configuration

The GD25Q16CSJGR follows the standard SOP8 pin configuration:

1. Chip Select (/CS)
2. Serial Clock (SCLK)
3. Serial Data Input (SI)
4. Serial Data Output (SO)
5. Write Protect (/WP)
6. Hold (/HOLD)
7. Ground (GND)
8. Power Supply (VCC)

Functional Features

• High-speed data transfer rate up to 104 MHz
• Flexible erase capability: sector, block, or chip erase
• Low power consumption during active and standby modes
• Hardware write protection for enhanced security
• Efficient programming algorithms for fast data storage

Advantages and Disadvantages

Advantages: - Compact package size allows for easy integration into various electronic devices - High-speed data transfer enables quick access to stored information - Low power consumption prolongs battery life in portable devices - Versatile erase capabilities provide flexibility in managing data storage

Disadvantages: - Limited storage capacity compared to larger flash memory options - Relatively higher cost per megabyte compared to other memory technologies

Working Principles

The GD25Q16CSJGR operates based on the Serial Peripheral Interface (SPI) protocol. It uses a combination of clock and data signals to communicate with the host device. The SPI interface allows for high-speed data transfer between the flash memory and the device it is connected to.

Detailed Application Field Plans

The GD25Q16CSJGR finds applications in various electronic devices, including but not limited to: 1. Consumer electronics (e.g., smartphones, tablets, digital cameras) 2. Automotive systems (e.g., infotainment systems, instrument clusters) 3. Industrial equipment (e.g., control systems, measurement devices) 4. Networking devices (e.g., routers, switches) 5. Medical devices (e.g., patient monitoring systems, diagnostic equipment)

Alternative Models

1. GD25Q32CSIGR: 32 Megabits (4 Megabytes) capacity, same package and interface as GD25Q16CSJGR
2. GD25Q64CSIGR: 64 Megabits (8 Megabytes) capacity, same package and interface as GD25Q16CSJGR
3. GD25Q128CSIGR: 128 Megabits (16 Megabytes) capacity, same package and interface as GD25Q16CSJGR

Note: The above alternative models are provided by the same manufacturer and have similar specifications and pin configurations.

This entry provides an overview of the GD25Q16CSJGR flash memory, including its product details, specifications, functional features, advantages, disadvantages, working principles, application field plans, and alternative models.