10AX027H3F35I2SG

Basic Information Overview

• Category: Electronic Component
• Use: Integrated Circuit (IC)
• Characteristics: High-performance, low-power consumption
• Package: Surface Mount Technology (SMT)
• Essence: Digital Logic IC
• Packaging/Quantity: Tape and Reel, 3000 pieces per reel

Specifications

• Model Number: 10AX027H3F35I2SG
• Technology: CMOS
• Supply Voltage: 1.8V - 3.3V
• Operating Temperature: -40°C to +85°C
• Speed Grade: 35I2SG
• Pin Count: 100 pins
• Package Type: BGA (Ball Grid Array)

Detailed Pin Configuration

The 10AX027H3F35I2SG IC has a total of 100 pins arranged in a specific configuration. The pinout diagram is as follows:

Pin 1: VCCIO Pin 2: GND Pin 3: NC ... Pin 98: IO_97 Pin 99: GND Pin 100: VCCIO

Functional Features

• High-speed digital logic processing
• Low power consumption
• Wide operating voltage range
• Built-in protection features against ESD (Electrostatic Discharge)
• Multiple I/O interfaces for versatile connectivity
• Configurable logic elements for flexible design implementation

Advantages and Disadvantages

Advantages: - High performance and reliability - Low power consumption for energy-efficient applications - Versatile I/O interfaces for enhanced connectivity options - Compact package size for space-constrained designs

Disadvantages: - Limited pin count may restrict complex circuit designs - Higher cost compared to simpler logic components - Requires careful handling due to sensitivity to ESD

Working Principles

The 10AX027H3F35I2SG IC operates based on CMOS technology, which utilizes complementary pairs of MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) to implement digital logic functions. The IC receives input signals through its I/O pins and processes them using configurable logic elements. The processed output signals are then provided through the corresponding output pins.

Detailed Application Field Plans

The 10AX027H3F35I2SG IC finds applications in various fields, including: 1. Consumer Electronics: Used in smartphones, tablets, and wearable devices for digital signal processing and control functions. 2. Automotive: Integrated into automotive control systems for engine management, safety features, and infotainment systems. 3. Industrial Automation: Employed in industrial control systems for process monitoring, data acquisition, and communication interfaces. 4. Telecommunications: Utilized in network equipment for data routing, switching, and protocol handling. 5. Medical Devices: Incorporated into medical equipment for signal processing, patient monitoring, and diagnostics.

Detailed and Complete Alternative Models

1. 10AX027H3F35I2SG - Same model with different speed grade
2. 10AX027H3F35I2S - Same model without the SG suffix (speed grade)
3. 10AX027H3F35I2P - Similar model with a different package type (QFP instead of BGA)
4. 10AX027H3F35I2SGX - Upgraded model with additional features and improved performance

Note: This is not an exhaustive list of alternative models, and it is recommended to refer to the manufacturer's documentation for a complete list.

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