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EP2AGX260FF35I3N
Product Overview
- Category: Integrated Circuit (IC)
- Use: Programmable Logic Device (PLD)
- Characteristics: High-performance, low-power consumption
- Package: Flip-Chip BGA (Ball Grid Array)
- Essence: Field-Programmable Gate Array (FPGA)
- Packaging/Quantity: Single unit
Specifications
- Manufacturer: Intel Corporation
- Technology: 20 nm
- Logic Elements: 260,000
- Embedded Memory: 5,760 Kbits
- Maximum User I/Os: 1,040
- Operating Voltage: 1.2V
- Operating Temperature: -40°C to +100°C
- Package Dimensions: 35mm x 35mm
Detailed Pin Configuration
The EP2AGX260FF35I3N has a complex pin configuration with multiple pins dedicated to various functions. The detailed pin configuration can be found in the manufacturer's datasheet.
Functional Features
- High-performance FPGA with advanced logic elements
- Low-power consumption for energy-efficient applications
- Large embedded memory for data storage and processing
- Wide range of user I/Os for versatile connectivity options
- Supports various communication protocols and interfaces
- Configurable through programming for flexibility in design
Advantages and Disadvantages
Advantages
- High-performance capabilities suitable for demanding applications
- Low-power consumption extends battery life in portable devices
- Versatile I/O options enable seamless integration with other components
- Configurability allows for customization and adaptability
- Large embedded memory enhances data processing capabilities
Disadvantages
- Complex pin configuration may require careful planning and design
- Higher cost compared to simpler programmable logic devices
- Steeper learning curve for beginners due to advanced features
Working Principles
The EP2AGX260FF35I3N is based on the field-programmable gate array (FPGA) technology. It consists of a large number of configurable logic elements that can be interconnected to perform complex digital functions. The device can be programmed using hardware description languages (HDLs) or graphical tools, allowing designers to create custom logic circuits and implement various functionalities.
Detailed Application Field Plans
The EP2AGX260FF35I3N finds applications in a wide range of industries and fields, including:
- Telecommunications: Used in network infrastructure equipment for high-speed data processing and routing.
- Aerospace and Defense: Utilized in radar systems, avionics, and military communication devices.
- Industrial Automation: Employed in control systems, robotics, and factory automation.
- Automotive: Integrated into advanced driver-assistance systems (ADAS) and infotainment systems.
- Medical Devices: Used in medical imaging, patient monitoring, and diagnostic equipment.
Detailed and Complete Alternative Models
- EP2AGX125EF29C6N: A lower-cost alternative with reduced logic elements but similar features.
- EP2AGX190EF35I4N: Offers higher logic capacity and additional embedded memory.
- EP2AGX400EF35I5N: Provides increased performance and I/O capabilities for demanding applications.
Note: This is not an exhaustive list, and there are several other alternative models available from Intel Corporation and other FPGA manufacturers.
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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací EP2AGX260FF35I3N v technických řešeních
Sure! Here are 10 common questions and answers related to the application of EP2AGX260FF35I3N in technical solutions:
Q: What is EP2AGX260FF35I3N? A: EP2AGX260FF35I3N is a specific model of field-programmable gate array (FPGA) manufactured by Intel.
Q: What are the key features of EP2AGX260FF35I3N? A: EP2AGX260FF35I3N offers high-density programmable logic, embedded memory blocks, digital signal processing (DSP) capabilities, and various I/O interfaces.
Q: In what applications can EP2AGX260FF35I3N be used? A: EP2AGX260FF35I3N is commonly used in applications such as telecommunications, industrial automation, automotive electronics, and aerospace systems.
Q: How does EP2AGX260FF35I3N benefit telecommunications applications? A: EP2AGX260FF35I3N provides high-speed data processing, flexible protocol support, and efficient implementation of complex algorithms required in telecommunications infrastructure.
Q: Can EP2AGX260FF35I3N be used for image and video processing? A: Yes, EP2AGX260FF35I3N's DSP capabilities and high-performance computing make it suitable for image and video processing applications, including real-time video analytics.
Q: What advantages does EP2AGX260FF35I3N offer in industrial automation? A: EP2AGX260FF35I3N enables precise control, rapid response times, and integration with various sensors and actuators, making it ideal for industrial automation systems.
Q: Is EP2AGX260FF35I3N suitable for safety-critical automotive applications? A: Yes, EP2AGX260FF35I3N supports functional safety standards and offers features like error detection and correction, making it suitable for safety-critical automotive systems.
Q: Can EP2AGX260FF35I3N be used in aerospace systems? A: Absolutely, EP2AGX260FF35I3N's high reliability, radiation tolerance, and ability to withstand harsh environments make it a good fit for aerospace applications.
Q: What development tools are available for programming EP2AGX260FF35I3N? A: Intel provides Quartus Prime software, which includes a suite of design tools for programming and configuring EP2AGX260FF35I3N FPGAs.
Q: Are there any specific design considerations when using EP2AGX260FF35I3N? A: Yes, designers should consider power consumption, thermal management, I/O requirements, and system integration aspects while utilizing EP2AGX260FF35I3N in their designs.
Please note that the answers provided here are general and may vary depending on specific project requirements and application scenarios.