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EP3SE260H780I3N

EP3SE260H780I3N

Product Overview

  • Category: Field Programmable Gate Array (FPGA)
  • Use: Digital logic circuits, signal processing, and system integration
  • Characteristics: High-performance, reprogrammable, and flexible
  • Package: BGA (Ball Grid Array)
  • Essence: Integrated circuit that can be programmed to perform various functions
  • Packaging/Quantity: Single unit per package

Specifications

  • Model: EP3SE260H780I3N
  • Manufacturer: Intel Corporation
  • Technology: 65nm
  • Logic Elements: 260,000
  • Embedded Memory: 1,152 Kbits
  • Maximum User I/Os: 780
  • Operating Voltage: 1.2V
  • Speed Grade: Industrial (-I3)
  • Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The EP3SE260H780I3N FPGA has a complex pin configuration with multiple pins for different purposes. Please refer to the manufacturer's datasheet for the detailed pinout information.

Functional Features

  • High-performance computing capabilities
  • Configurable logic blocks for custom circuit design
  • On-chip memory for data storage
  • Flexible I/O interfaces for communication with external devices
  • Built-in clock management resources for precise timing control
  • Support for various communication protocols and standards

Advantages and Disadvantages

Advantages: - Versatile and adaptable for a wide range of applications - Reprogrammable nature allows for iterative development and updates - High-speed operation for real-time processing requirements - Integration of multiple functions into a single chip reduces system complexity

Disadvantages: - Higher power consumption compared to dedicated ASICs - Limited resources may restrict the complexity of designs - Longer development time due to programming and verification processes

Working Principles

The EP3SE260H780I3N FPGA operates based on the principles of configurable logic. It consists of a large number of programmable logic elements interconnected through configurable routing resources. These logic elements can be programmed to implement various digital circuits and functions.

The programming process involves specifying the desired circuit configuration using a hardware description language (HDL) and then synthesizing it into a bitstream file. This bitstream is then loaded onto the FPGA, configuring its internal resources accordingly.

Once programmed, the FPGA can perform the specified functions by manipulating the input signals and producing the desired output signals through the configured logic elements and interconnections.

Detailed Application Field Plans

The EP3SE260H780I3N FPGA finds applications in various fields, including:

  1. Communications: Used in wireless base stations, network routers, and switches for signal processing and protocol handling.
  2. Industrial Automation: Employed in control systems, robotics, and machine vision applications for real-time data processing and control.
  3. Aerospace and Defense: Utilized in radar systems, avionics, and military communication equipment for high-performance computing and signal processing.
  4. Medical Devices: Integrated into medical imaging systems, patient monitoring devices, and laboratory equipment for data acquisition and processing.
  5. Automotive: Applied in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs) for enhanced functionality and performance.

Detailed and Complete Alternative Models

  1. Xilinx Virtex-7 XC7VX690T-2FFG1761C
  2. Lattice ECP5-85F-6BG256C
  3. Microsemi SmartFusion2 M2S090TS-1FGG484I
  4. Altera Cyclone V GT 5CGTFD9E5F35C7N
  5. QuickLogic EOS S3 LP3BA-1

These alternative models offer similar capabilities and can be considered as alternatives to the EP3SE260H780I3N FPGA based on specific project requirements.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací EP3SE260H780I3N v technických řešeních

Sure! Here are 10 common questions and answers related to the application of EP3SE260H780I3N in technical solutions:

  1. Q: What is EP3SE260H780I3N? A: EP3SE260H780I3N is a specific model of Field-Programmable Gate Array (FPGA) manufactured by Intel.

  2. Q: What are the key features of EP3SE260H780I3N? A: EP3SE260H780I3N offers high-performance processing capabilities, large capacity for logic and memory, and various I/O interfaces.

  3. Q: In what technical solutions can EP3SE260H780I3N be used? A: EP3SE260H780I3N can be used in a wide range of applications such as telecommunications, industrial automation, image processing, and data centers.

  4. Q: How does EP3SE260H780I3N contribute to telecommunications solutions? A: EP3SE260H780I3N enables high-speed data processing, efficient signal processing, and flexible protocol implementation in telecommunications systems.

  5. Q: Can EP3SE260H780I3N be used in industrial automation solutions? A: Yes, EP3SE260H780I3N can be utilized in industrial automation for tasks like real-time control, sensor interfacing, and communication protocols.

  6. Q: What advantages does EP3SE260H780I3N offer in image processing applications? A: EP3SE260H780I3N provides parallel processing capabilities, enabling faster image analysis, object recognition, and video processing.

  7. Q: How does EP3SE260H780I3N support data centers? A: EP3SE260H780I3N can be used in data centers for tasks like high-speed data routing, encryption/decryption, and virtualization support.

  8. Q: Can EP3SE260H780I3N interface with other devices? A: Yes, EP3SE260H780I3N supports various I/O interfaces such as PCIe, Ethernet, USB, and DDR memory interfaces for seamless integration with other devices.

  9. Q: What development tools are available for programming EP3SE260H780I3N? A: Intel Quartus Prime is the primary development tool used to program and configure EP3SE260H780I3N FPGA.

  10. Q: Are there any specific design considerations when using EP3SE260H780I3N? A: Yes, designers should consider power consumption, thermal management, and signal integrity while designing solutions with EP3SE260H780I3N.

Please note that the answers provided here are general and may vary depending on the specific requirements and context of the technical solution.