Obrázek může být reprezentace.
Viz Specifikace pro podrobnosti o produktu.
IS42S83200G-6TL

IS42S83200G-6TL

Product Overview

Category

IS42S83200G-6TL belongs to the category of dynamic random access memory (DRAM) chips.

Use

This product is primarily used in electronic devices such as computers, smartphones, and tablets for storing and accessing data quickly.

Characteristics

  • High-speed data storage and retrieval capabilities
  • Low power consumption
  • Compact size
  • Wide temperature range operation
  • Reliable performance

Package

IS42S83200G-6TL is available in a small outline, thin profile (TSOP) package.

Essence

The essence of IS42S83200G-6TL lies in its ability to provide fast and efficient data storage and retrieval in electronic devices.

Packaging/Quantity

IS42S83200G-6TL is typically packaged in reels or trays, with each reel or tray containing a specific quantity of chips. The exact packaging and quantity may vary depending on the manufacturer.

Specifications

  • Memory Type: Synchronous DRAM (SDRAM)
  • Capacity: 32 Megabits (4 Megabytes)
  • Organization: 2M words x 16 bits x 4 banks
  • Operating Voltage: 3.3V ± 0.3V
  • Clock Frequency: 166 MHz
  • Access Time: 6 ns
  • Interface: Parallel
  • Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

IS42S83200G-6TL has a total of 54 pins. The pin configuration is as follows:

  1. VDD
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. VSS
  11. DQ8
  12. DQ9
  13. DQ10
  14. DQ11
  15. DQ12
  16. DQ13
  17. DQ14
  18. DQ15
  19. VSS
  20. A0
  21. A1
  22. A2
  23. A3
  24. A4
  25. A5
  26. A6
  27. A7
  28. A8
  29. A9
  30. A10
  31. A11
  32. A12
  33. A13
  34. A14
  35. A15
  36. A16
  37. A17
  38. A18
  39. A19
  40. A20
  41. A21
  42. A22
  43. A23
  44. /CAS
  45. /RAS
  46. /WE
  47. /CS0
  48. /CS1
  49. /CS2
  50. /CS3
  51. /CKE
  52. /CLK
  53. /DQM0
  54. /DQM1

Functional Features

  • Burst mode operation for high-speed data transfer
  • Auto-refresh and self-refresh modes for power-saving
  • On-die termination (ODT) for improved signal integrity
  • Programmable burst length and latency settings
  • Multiple bank architecture for concurrent access

Advantages and Disadvantages

Advantages

  • High-speed data storage and retrieval
  • Low power consumption
  • Compact size
  • Wide temperature range operation
  • Reliable performance

Disadvantages

  • Limited capacity compared to other memory technologies
  • Higher cost per unit compared to some alternative models

Working Principles

IS42S83200G-6TL operates based on the principles of synchronous dynamic random access memory. It stores data in a matrix of capacitors, with each capacitor representing a single bit of information. The data is accessed by sending specific commands and addresses to the memory chip, which activates the appropriate row and column to read or write data.

Detailed Application Field Plans

IS42S83200G-6TL finds applications in various electronic devices, including but not limited to: - Personal computers - Laptops - Servers - Mobile phones - Tablets - Gaming consoles - Networking equipment

Detailed and Complete Alternative Models

Some alternative models to IS42S83200G-6TL that offer similar functionality include: - MT48LC32M16A2P-75: 32 Megabit SDRAM, 166 MHz, TSOP package - K4S561632H-UC75: 32 Megabit SDRAM, 166 MHz, TSOP package - HYB39S256160FE-7: 32 Megabit SDRAM, 166 MHz, TSOP package

These alternative models can be considered based on specific requirements and availability.

Word count: 550 words

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací IS42S83200G-6TL v technických řešeních

Sure! Here are 10 common questions and answers related to the application of IS42S83200G-6TL in technical solutions:

  1. Q: What is IS42S83200G-6TL? A: IS42S83200G-6TL is a specific type of synchronous dynamic random-access memory (SDRAM) chip commonly used in electronic devices for data storage and retrieval.

  2. Q: What is the capacity of IS42S83200G-6TL? A: The IS42S83200G-6TL has a capacity of 256 megabits (32 megabytes).

  3. Q: What is the operating voltage range for IS42S83200G-6TL? A: The operating voltage range for IS42S83200G-6TL is typically 2.5V to 2.75V.

  4. Q: What is the maximum clock frequency supported by IS42S83200G-6TL? A: The maximum clock frequency supported by IS42S83200G-6TL is 166 MHz.

  5. Q: Can IS42S83200G-6TL be used in mobile devices? A: Yes, IS42S83200G-6TL can be used in mobile devices such as smartphones and tablets that require high-speed memory for efficient data processing.

  6. Q: Is IS42S83200G-6TL compatible with different microcontrollers? A: Yes, IS42S83200G-6TL is designed to be compatible with various microcontrollers and can be easily integrated into different technical solutions.

  7. Q: Does IS42S83200G-6TL support burst mode operation? A: Yes, IS42S83200G-6TL supports burst mode operation, allowing for faster data transfer rates.

  8. Q: Can IS42S83200G-6TL be used in industrial applications? A: Yes, IS42S83200G-6TL is suitable for industrial applications that require reliable and high-performance memory solutions.

  9. Q: What is the package type of IS42S83200G-6TL? A: IS42S83200G-6TL comes in a 90-ball FBGA (Fine-Pitch Ball Grid Array) package.

  10. Q: Are there any specific design considerations when using IS42S83200G-6TL? A: Yes, it is important to consider factors such as signal integrity, power supply stability, and proper timing constraints when designing with IS42S83200G-6TL to ensure optimal performance.

Please note that these answers are general and may vary depending on the specific requirements and technical details of your application.