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MT29F512G08CUCABH3-10RZ:A

MT29F512G08CUCABH3-10RZ:A

Product Overview

Category: NAND Flash Memory
Use: Data storage in electronic devices
Characteristics: High capacity, fast read/write speeds, non-volatile memory
Package: BGA (Ball Grid Array)
Essence: Reliable and efficient data storage solution
Packaging/Quantity: Individually packaged, quantity varies based on customer requirements

Specifications

  • Model: MT29F512G08CUCABH3-10RZ:A
  • Capacity: 512GB
  • Interface: Toggle NAND
  • Voltage: 2.7V - 3.6V
  • Operating Temperature: -40°C to +85°C
  • Read Speed: Up to 400MB/s
  • Write Speed: Up to 200MB/s
  • Endurance: 3,000 Program/Erase cycles
  • Data Retention: Up to 10 years

Pin Configuration

The MT29F512G08CUCABH3-10RZ:A follows a standard pin configuration for BGA packages. The specific pin assignments are as follows:

  1. VCC
  2. VCCQ
  3. GND
  4. CE#
  5. RE#
  6. WE#
  7. CLE
  8. ALE
  9. WP#
  10. R/B#
  11. DQ0
  12. DQ1
  13. DQ2
  14. DQ3
  15. DQ4
  16. DQ5
  17. DQ6
  18. DQ7
  19. NC
  20. NC
  21. NC
  22. NC
  23. NC
  24. NC
  25. NC
  26. NC
  27. NC
  28. NC
  29. NC
  30. NC
  31. NC
  32. NC
  33. NC
  34. NC
  35. NC
  36. NC
  37. NC
  38. NC
  39. NC
  40. NC

Functional Features

  • High-speed data transfer for efficient read/write operations
  • Toggle NAND interface for improved performance
  • Reliable and durable with high endurance and data retention capabilities
  • Low power consumption for energy-efficient operation
  • Error correction and wear-leveling algorithms for enhanced reliability
  • Advanced security features to protect stored data

Advantages and Disadvantages

Advantages: - Large storage capacity of 512GB - Fast read/write speeds for quick data access - Non-volatile memory retains data even without power - Suitable for a wide range of electronic devices - Robust design ensures durability and longevity

Disadvantages: - Higher cost compared to lower capacity NAND flash memory options - Limited compatibility with older devices that do not support the toggle NAND interface

Working Principles

The MT29F512G08CUCABH3-10RZ:A utilizes NAND flash memory technology to store and retrieve data. It consists of multiple memory cells organized in a grid-like structure. Each cell can store multiple bits of information, allowing for high-density data storage.

During write operations, electrical charges are applied to the memory cells to store data. Reading involves detecting the presence or absence of charges in the cells. The toggle NAND interface enables fast data transfer between the memory and the device it is connected to.

Detailed Application Field Plans

The MT29F512G08CUCABH3-10RZ:A is widely used in various electronic devices that require high-capacity data storage. Some common application fields include:

  1. Solid-State Drives (SSDs)
  2. Smartphones and tablets
  3. Digital cameras and camcorders
  4. Gaming consoles
  5. Automotive infotainment systems
  6. Industrial control systems
  7. Medical devices

Detailed Alternative Models

  1. MT29F512G08CUCABH3-10RZ:B - Similar specifications, different package type (TSOP)
  2. MT29F512G08CUCABH3-10RZ:C - Higher capacity (1TB), otherwise similar specifications
  3. MT29F256G08CUCAAA3-10RZ:A - Lower capacity (256GB), otherwise similar specifications

These alternative models offer flexibility in terms of package type, capacity, and compatibility with different devices.

In conclusion, the MT29F512G08CUCABH3-10RZ:A is a high-capacity NAND flash memory designed for reliable data storage in various electronic devices. Its fast read/write speeds, non-volatile nature, and robust design make it an ideal choice for applications requiring large amounts of data storage.

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací MT29F512G08CUCABH3-10RZ:A v technických řešeních

  1. Question: What is the capacity of the MT29F512G08CUCABH3-10RZ:A?
    Answer: The MT29F512G08CUCABH3-10RZ:A has a capacity of 512 gigabits (64 gigabytes).

  2. Question: What is the interface used by the MT29F512G08CUCABH3-10RZ:A?
    Answer: The MT29F512G08CUCABH3-10RZ:A uses a NAND Flash interface.

  3. Question: What is the operating voltage range for this device?
    Answer: The MT29F512G08CUCABH3-10RZ:A operates at a voltage range of 2.7V to 3.6V.

  4. Question: What is the maximum data transfer rate supported by this device?
    Answer: The MT29F512G08CUCABH3-10RZ:A supports a maximum data transfer rate of up to 200 megabytes per second.

  5. Question: Is this device suitable for automotive applications?
    Answer: Yes, the MT29F512G08CUCABH3-10RZ:A is designed for automotive-grade applications and meets the necessary requirements.

  6. Question: Can this device be used in industrial environments with high temperature ranges?
    Answer: Yes, the MT29F512G08CUCABH3-10RZ:A is designed to operate in industrial temperature ranges, making it suitable for such environments.

  7. Question: Does this device support hardware encryption?
    Answer: No, the MT29F512G08CUCABH3-10RZ:A does not have built-in hardware encryption capabilities.

  8. Question: What is the endurance rating of this device?
    Answer: The MT29F512G08CUCABH3-10RZ:A has an endurance rating of 3,000 program/erase cycles.

  9. Question: Can this device be used as a boot device in embedded systems?
    Answer: Yes, the MT29F512G08CUCABH3-10RZ:A can be used as a boot device in embedded systems.

  10. Question: Is this device compatible with various operating systems and file systems?
    Answer: Yes, the MT29F512G08CUCABH3-10RZ:A is compatible with different operating systems and supports popular file systems like FAT32 and exFAT.