ON Semiconductor
Obrázek může být reprezentace.
Viz Specifikace pro podrobnosti o produktu.
SBC847BPDXV6T1G
Zobrazit detail DataSheets

SBC847BPDXV6T1G

Introduction

The SBC847BPDXV6T1G is a Single Board Computer (SBC) designed for embedded computing applications. This entry provides an overview of the product, including its basic information, specifications, detailed pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.

Basic Information Overview

  • Category: Embedded Computing
  • Use: Industrial Automation, IoT Devices, Robotics, Embedded Systems
  • Characteristics: Low Power Consumption, Compact Size, High Performance
  • Package: Surface Mount Technology (SMT)
  • Essence: Integration of Processor, Memory, I/O Interfaces on a Single Board
  • Packaging/Quantity: Varies by Manufacturer

Specifications

  • Processor: Intel® Core™ i7/i5/i3 or equivalent
  • Memory: Up to 32GB DDR4 RAM
  • Storage: SATA, mSATA, M.2
  • I/O Interfaces: USB, Ethernet, Serial Ports, GPIO
  • Expansion Slots: PCIe, Mini PCIe
  • Operating Temperature: -40°C to 85°C
  • Power Input: 9-36V DC

Detailed Pin Configuration

  • Processor Interface: LGA1151 Socket
  • Memory Slots: SO-DIMM
  • I/O Connectors: RJ45, USB Type-A/B, DB9, GPIO Headers

Functional Features

  • High Performance: Capable of running demanding applications
  • Versatile I/O: Supports various interfaces for connectivity
  • Robust Design: Suitable for harsh industrial environments
  • Expandability: Provides expansion slots for additional functionality

Advantages and Disadvantages

Advantages

  • High Processing Power
  • Wide Operating Temperature Range
  • Compact Form Factor
  • Expandable I/O Options

Disadvantages

  • Higher Cost Compared to Entry-Level SBCs
  • Limited Availability of Alternative Models

Working Principles

The SBC847BPDXV6T1G operates as the central processing unit in embedded systems, executing tasks based on programmed instructions. It communicates with peripherals and external devices through its I/O interfaces, enabling the overall functionality of the embedded system.

Detailed Application Field Plans

  • Industrial Automation: Control systems, data acquisition
  • IoT Devices: Edge computing, sensor integration
  • Robotics: Motion control, vision processing
  • Embedded Systems: Customized applications, kiosks

Detailed and Complete Alternative Models

  • SBC846BPDXV5T1G: Previous generation with similar features
  • SBC848BPDXV7T1G: Upgraded version with enhanced performance
  • SBC849BPDXV6T1G: Variant with additional I/O options

In conclusion, the SBC847BPDXV6T1G serves as a powerful and versatile solution for embedded computing applications, offering high performance, expandability, and robustness. Its wide range of applications and limited alternatives make it a significant player in the embedded computing market.

Word Count: 411

Seznam 10 běžných otázek a odpovědí souvisejících s aplikací SBC847BPDXV6T1G v technických řešeních

  1. What is SBC847BPDXV6T1G?

    • SBC847BPDXV6T1G is a low-power, high-performance NPN bipolar junction transistor (BJT) designed for use in various technical solutions.

  2. What are the key features of SBC847BPDXV6T1G?

    • The key features include low saturation voltage, high current gain, and high-speed switching, making it suitable for a wide range of applications.

  3. In what technical solutions can SBC847BPDXV6T1G be used?

    • SBC847BPDXV6T1G can be used in power management, motor control, audio amplification, and general purpose switching applications.

  4. What is the maximum collector current rating of SBC847BPDXV6T1G?

    • The maximum collector current rating is typically 100mA, making it suitable for low to medium power applications.

  5. What is the typical gain of SBC847BPDXV6T1G?

    • The typical current gain (hFE) of SBC847BPDXV6T1G ranges from 200 to 600, depending on the operating conditions.

  6. What is the maximum power dissipation of SBC847BPDXV6T1G?

    • The maximum power dissipation is typically 250mW, allowing for reliable operation in various technical solutions.

  7. Does SBC847BPDXV6T1G require any special thermal considerations?

    • While SBC847BPDXV6T1G has a low thermal resistance, it is recommended to consider proper heat sinking in high-power applications to ensure optimal performance.

  8. Can SBC847BPDXV6T1G be used in high-frequency applications?

    • Yes, SBC847BPDXV6T1G is capable of operating at high frequencies, making it suitable for RF amplification and other high-speed applications.

  9. What are the common package types available for SBC847BPDXV6T1G?

    • SBC847BPDXV6T1G is commonly available in small outline transistor (SOT-23) and surface mount (SOT-323) packages for ease of integration into various designs.

  10. Are there any specific design considerations when using SBC847BPDXV6T1G in technical solutions?

    • Designers should consider proper biasing, thermal management, and voltage/current limitations to ensure reliable and efficient operation of SBC847BPDXV6T1G in their technical solutions.