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DF5A6.8CFU(TE85L,F

DF5A6.8CFU(TE85L,F: Product Overview and Specifications

Introduction

DF5A6.8CFU(TE85L,F) is a semiconductor product belonging to the category of Schottky Barrier Diodes (SBD). This component is widely used in electronic circuits for its unique characteristics, packaging, and functional features.

Basic Information Overview

  • Category: Schottky Barrier Diodes (SBD)
  • Use: Rectification and voltage clamping in electronic circuits
  • Characteristics: Low forward voltage drop, fast switching speed, high current density
  • Package: SOD-323F
  • Essence: Semiconductor diode
  • Packaging/Quantity: Tape & Reel, 3000 units per reel

Specifications

  • Forward Voltage: 0.38V
  • Reverse Voltage: 60V
  • Average Rectified Current: 500mA
  • Peak Surge Forward Current: 2A
  • Operating Temperature Range: -55°C to +125°C

Detailed Pin Configuration

The DF5A6.8CFU(TE85L,F) follows the standard SOD-323F package configuration with two pins for connection.

Functional Features

  • Low forward voltage drop ensures minimal power loss
  • Fast switching speed allows for efficient circuit operation
  • High current density enables handling of high power applications

Advantages and Disadvantages

Advantages

  • Efficient power conversion due to low forward voltage drop
  • Suitable for high-frequency applications
  • Compact package size for space-constrained designs

Disadvantages

  • Limited reverse voltage capability compared to other diode types
  • Sensitivity to temperature variations may require additional thermal management

Working Principles

The DF5A6.8CFU(TE85L,F) operates based on the Schottky barrier principle, where the metal-semiconductor junction provides low forward voltage drop and fast switching characteristics.

Detailed Application Field Plans

This diode is commonly used in: - Switching power supplies - Voltage clamping circuits - Reverse polarity protection circuits - High-frequency rectification applications

Detailed and Complete Alternative Models

  • 1N5819: Similar SBD with higher reverse voltage capability
  • SS14: SMD diode with comparable specifications
  • BAT54C: Dual SBD for compact circuit designs

In conclusion, the DF5A6.8CFU(TE85L,F) Schottky Barrier Diode offers efficient rectification and voltage clamping capabilities for various electronic applications, making it a valuable component in modern circuit design.

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Seznam 10 běžných otázek a odpovědí souvisejících s aplikací DF5A6.8CFU(TE85L,F v technických řešeních

Sure, here are 10 common questions and answers related to the application of DF5A6.8CFU(TE85L,F in technical solutions:

  1. What is the operating temperature range for DF5A6.8CFU(TE85L,F?

    • The operating temperature range for DF5A6.8CFU(TE85L,F is typically -55°C to +150°C.
  2. What is the maximum forward voltage drop for DF5A6.8CFU(TE85L,F?

    • The maximum forward voltage drop for DF5A6.8CFU(TE85L,F is around 0.35V at a forward current of 1A.
  3. Can DF5A6.8CFU(TE85L,F be used in automotive applications?

    • Yes, DF5A6.8CFU(TE85L,F is suitable for use in automotive applications, including in-vehicle electronics and power management systems.
  4. What is the typical reverse leakage current for DF5A6.8CFU(TE85L,F?

    • The typical reverse leakage current for DF5A6.8CFU(TE85L,F is in the range of microamps (μA) at its rated voltage.
  5. Is DF5A6.8CFU(TE85L,F RoHS compliant?

    • Yes, DF5A6.8CFU(TE85L,F is RoHS compliant, making it suitable for use in environmentally sensitive applications.
  6. What are the recommended storage conditions for DF5A6.8CFU(TE85L,F?

    • It is recommended to store DF5A6.8CFU(TE85L,F in a dry environment at temperatures not exceeding 40°C.
  7. Can DF5A6.8CFU(TE85L,F be used in high-frequency applications?

    • Yes, DF5A6.8CFU(TE85L,F is suitable for use in high-frequency applications due to its fast switching characteristics.
  8. What is the maximum junction temperature for DF5A6.8CFU(TE85L,F?

    • The maximum junction temperature for DF5A6.8CFU(TE85L,F is typically 175°C, beyond which its electrical characteristics may degrade.
  9. Does DF5A6.8CFU(TE85L,F require a heat sink for certain applications?

    • In high-power or high-temperature applications, it is advisable to use a heat sink to maintain optimal performance and reliability.
  10. Are there any specific layout considerations when using DF5A6.8CFU(TE85L,F in PCB designs?

    • It is recommended to minimize trace lengths and keep the device close to the power source to reduce parasitic effects and optimize performance.